PCB Design-FS Technology

Summary: The design of the circuit board is based on the circuit diagram to perform the functions required by the circuit designer. The design of the printed circuit board is primarily a model design, which must take into account the shape of the external connectors, the correct shape of the internal electronic components, and the precise pattern of metal and hole connections. So what is the PCB design process like? FS Technology will explain the design of printed circuit boards for you

What is the design process of FS Tech PCB circuit?
1. Planning and Design
The special performance of PCB should be the main components of high-frequency components, the main components of circuits, interference components, high-voltage components, high-heating components and other components. The condition of these specific parts of the opposite sex. It must be carefully evaluated and the belt configuration must meet the operational and manufacturing requirements of the chain. Improper layout can lead to FS Technology circuit compatibility, signal integrity issues, and PCB design defects.

When designing special components, the first consideration is the size of the circuit board. Kuaiwang pointed out that when the PCB size is too large, the printing length increases, the resistance increases, the dry resistance decreases, and the cost increases; if it is too small, the heat dissipation is not good, and it is easy to interfere with adjacent pipes. After setting the FS Technology PCB dimensions, look for the location of the special features. Finally, all components in the circuit are configured according to the functionality of the device. The arrangement of special functions in a circuit board is usually done according to the following principles:

Minimize contact between high frequency components, minimize electromagnetic distribution parameters and mutual interference. Interfering elements cannot be too close to each other, and the inlet and outlet must be as far apart as possible.

2. Some components or cables may vary greatly, so their distance should be increased to avoid the risk of short circuits caused by lightning strikes. High-voltage components must be kept out of reach.

FS Tech components weighing more than 15 G can be installed and welded. Due to heat distribution, those heavy and hot components should not be placed on the board, but on the board below the main frame. Heater parts should be kept away from hot areas.

4. All panel design specifications must be considered when configuring adjustable components such as potentiometers, adjustable inductors, variable capacitors, and microswitches. Some standard switches should be used when the system allows it. Lie down and hold your hand lightly. The layout of the components must be uniform, compact and not too heavy.

For a product to be successful, it must take into account the internal quality of FS Technology. Instead, it's important to consider the overall aesthetic, so the perfect shield will succeed.

The targeting sequence
1. Position the side assembly near power outlets, lights, switches, sockets, etc.

2. Install large-scale FS technology components, heavy components, heating components, transformers, integrated circuits and other special components.

Arrange small pieces.

3. Planning research

1. Is the board size and system size required to create the correct map?

2. The layout of each part is consistent, the organization is good, and the overall layout is perfect.

3. Are there levels of conflict? Sections, terms and conditions that must be published in trust may be copyrighted.

3. Common components are easy to use. Switches, Dash plug accessories, frequently replaced parts, and more.

4. Whether the distance between the heating part and the heating part is reasonable.